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PAP7501V
PAP7501V USB2.0 PC Camera Controller
General Description
The PAP7501V High-Speed USB2.0 Camera Controller is a highly integrated and cost-effective solution for USB2.0 PC-Camera based applications. It is fully compliant with USB Video Class 1.1 and USB audio class 1.0 standard.Internal controller can be power-up loaded from external EEPROM. This allows customization of VID, PID, product string, sensor parameters...etc.
Features .USB Features
USB 2.0 and 1.1 compliance(high speed and full speed transceiver). USB video class 1.1 compliance. USB audio class 1.0 compliance.
Key Specification
Supply Voltage Resolution Frame Rate System Clock 5.0V 10% Up to 640 (H) x 480 (V) Up to 30fps 12MHz <100mA
.Micro Controller Features
Built-in 8 bit micro controller with 40K-byte of mask Power consumption ROM and 24K-byte SRAM. Firmware supports AE, AWB, and USB protocol. Programmable codes uploaded from serial EEPROM/Flash.
.Sensor Controller Features.
Support up to VGA CMOS image sensors. Support 8 bit raw image data or YUV2 input from CMOS sensor. On chip color processor engine. Built-in MJPEG encoder. Support 2 wires serial interface for sensor control.
. Audio Controller Features
Audio interface: -Built in 10 bit mono audio ADC for audio recording through microphone. -Sampling rate @16/48kHZ, resolution 16 bits format. Recording, mute and volume control. . Miscellaneous Features Power consumption: < 100mA USB 5V power in, on-chip 3.3V regulator for IO PAD and PHY, on-chip 1.8V regulator for core logic.
Ordering Information
Order number PAP7501V Package Type 48-pin QFN Package Size(mm) 5.53 x 5.53
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PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw
V1.1 May. 2008
PixArt Imaging Inc. PAP7501V USB2.0 Camera
1. Pin Assignment
Pin# 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 Name GND33A_PLL_I VDD5MA VDD28A_MIC VCOM MIC_P MIC_N VDD33A_PGA VSSA VDD33A_ADC VSSQ RSTN SEN_CSB KEY GPIO4 VDD18K VDD33Q SEN_CLK SEN_SCL SEN_SDA I_VSYNC I_HSYNC EPR_CSB EPR_SO EPR_SI EPR_SCK I_PXD7 I_PXD6 I_PXD5 I_PXD4 I_PXD3 I_PXD2 I_PXD1 I_PXD0 I_PXCLK VDD5MD VDDAYS VDD5MV VSSQ VDD33A_HSRT_O VDD18K OSC_IN OSC_OUT VDD33A_HSRT_I GND33A_HSRT_I RRET DM DP VDD33A_PLL_I Type GND PWR BYPASS BYPASS IN IN BYPASS GND BYPASS GND IN OUT IN I/O BYPASS BYPASS OUT OUT I/O IN IN IN IN OUT OUT IN IN IN IN IN IN IN IN IN PWR BYPASS PWR GND BYPASS BYPASS IN OUT BYPASS GND IN I/O I/O BYPASS Description Ground for PLL 5V Power for analog circuit Analog power for Audio MIC, 2.8V Microphone common mode voltage reference Microphone positive input Microphone negative input Analog power for Audio PGA, 3.3V Microphone GND Analog power for Audio ADC, 3.3V Digital ground Chip power up reset (Internal pull-up 100Kohm) Chip select of EEPROM Snapshot control signal (Active Low, internal pull-up 100Kohm) General purpose I/O Logic power for digit circuit, 1.8V Logic power for digit circuit, 3.3V Clock output for sensor I2C clock I2C data Vertical synchronization signal Horizontal synchronization signal Chip Select of EEPROM Data out of EEPROM Data input of EEPROM Serial clock of EEPROM Sensor digital data input Sensor digital data input Sensor digital data input Sensor digital data input Sensor digital data input Sensor digital data input Sensor digital data input Sensor digital data input Sensor pixel clock input 5V power for digit circuit Logic power for digit circuit, 2.5V 5V power for PHY circuit Digital ground Analog power for TX/RX Logic power for digit circuit, 1.8V Crystal input Crystal output Analog power for TX/RX Ground for USB TX/RX Reference supply current for PHY DM for USB PHY DP for USB PHY Analog power for PLL
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PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw
V1.1 May. 2008
PixArt Imaging Inc. PAP7501V USB2.0 Camera
2.Block Diagram
The PAP7501V High-Speed USB2.0 Camera Controller is a highly integrated and cost-effective solution for USB2.0 PC-Camera based applications. It is fully compliant with USB Video Class 1.1 and USB audio class 1.0 standard. It integrates micro-controller, color processor engine, MJPEG encoder, and 24K-byte programmable SRAM.
All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission.
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PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw
V1.1 May. 2008
PixArt Imaging Inc. PAP7501V USB2.0 Camera
3. Specifications
Absolute Maximum Ratings
Exceeding the Absolute Maximum Ratings shown below invalidates all AC and DC electrical specifications and may result in permanent device damage.
Symbol TSTG VDD VIN VOUT ESD
Parameter Ambient storage temperature DC supply voltage DC input voltage DC output voltage ESD Rating, Human Body model
Min -25 -0.5 0.5 -0.5
Max 125 5.5 3.8 3.8 2
Unit C V V V kV
Notes
Recommend Operating Condition Symbol TA VDD FCLK Parameter Temperature Operation Range Stable Image Power supply voltage System clock frequency Min -10 0 4.5 Typ. 5.0 12.0 Max 70 50 5.5 Unit C C V MHz Notes
DC Electrical Characteristics (Typical values at 25C, VDD =5.0V, FCLK=12.0MHz) Symbol Type: PWR IDD IPWDN Operating Current Power Down current 70 500u mA @30 frame/sec Parameter Min. Typ. Max. Unit Notes
Type: IN & I/O, Reset VIH VIL Input voltage HIGH Input voltage LOW V V
Type: OUT & I/O VOH VOL Output voltage HIGH Output voltage LOW
0.9 x VDD33Q
-
0.1 x VDD33Q
V V
-
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PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw
V1.1 May. 2008
PixArt Imaging Inc. PAP7501V USB2.0 Camera
4. Packing Information 4.1 Product Ordering Information
Product Number
:
PAP7501
V
QFN 6*6 48L with lead-free process Part Number
4.2 Material List
4.3 Package Outline Dimension Saw Type(A type):
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PixArt Imaging Inc. PAP7501V USB2.0 Camera
Punch Type(U type):
4.4 Pin Assignment
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PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw
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PixArt Imaging Inc. PAP7501V USB2.0 Camera
4.5 Recommended Layout PCB
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PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw
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PixArt Imaging Inc. PAP7501V USB2.0 Camera
4.6 Packing Information
Anti-static PP band
Tray (11 pcs)
Static Shielding Bag
PART NO. : LOT NO. QTY QA : : :
Label
PACKING BOX
ELECTROSTATIC SENSITIVE DEVICES CAUTION LABEL
One packing box capacity One packing box Remark Tray durable temperature = 150 Note: 1. When the units is out of dry packing, should be operation at : Temperature = 30 , Humidity = 60% RH 4900 units ( 490 units x 10 Trays)
2. If units is out of dry packing over 168 hrs, before go through infrared reflow process must be bake with 125 the moisture. 5 @24hrs, to remove
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PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw
V1.1 May. 2008
PixArt Imaging Inc. PAP7501V USB2.0 Camera
4.7 Recommended Condition For Infrared Reflow
Carefully observe the mounting conditions, recommended temperature profile when Mounting infrared reflows is show in the figure below.
Melting area
Pre-heat
( Sec ) Recommend Pb-free solder paste vender & type : 1. Almit LFM-48W TM-HP 2. Senju M705-GRN360-K
Programming rate 1.5~2.5 oC/sec
Pre-heat 170~200oC 90 +/- 30 sec
Melting area >220oC 30~50sec with peak temperature 230~245oC
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PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw
V1.1 May. 2008
PixArt Imaging Inc. PAP7501V USB2.0 Camera
4.8 Handling precaution for the prevention of ESD
Explained below are procedures that must be taken in fabrication to prevent the electrostatic destruction of semiconductor devices. The following basic rules must be obeyed. 1. Equalize potentials of terminals when transporting or storing. 2. Equalize the potentials of the electric device, work table, and operator's body that may come in contact with the IC's. 3. Prepare an environment that does not generate static electricity. One method is keeping relative humidity in the work room to about 50%. Operator 1. The operator should wear wrist straps. (Must maintain electric contact with bare skin) 2. Wear cotton or antistatic-treated materials clothes and gloves. 3. When a conductive mat will be used, must be ware conductive shoes. 4. Do not touch the IC's leads. Touch the body of IC's when holding. Equipment and tools 1. Any electrical equipments and tools located on the work table surface must be isolated from The work table surface, and ground the equipments and tools that are to be used. 2. Work table surface must be use conductive material or conductive mat. (Should be ground through a 1M Transporting, storing and packing 1. Use conductive IC's tray, and conductive or shielding bag to store IC's. Soldering operation 1. Use a soldering iron with a grounding wire. 2. When perform manual soldering operation, the operator should wear wrist straps. 3. Do not use the desoldering pump when removing the IC's from the PCB board. Use a solder-wick or equivalent. resistor)
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PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw
V1.1 May. 2008
PixArt Imaging Inc. PAP7501V USB2.0 Camera
5. Reference Application Circuit 5.1 PAP7501 with PAS6311
I_HSYNC I_VSYNC I_PXCLK VDDAY VDDQ VDD33A_PLL_I VDDA VDDAY RESET U1 C3 0.1u D5 B5 C4 E5 E4 A2 CON1 R2 C9 4.7nF/250V VDD18K 8 9 USB_SHADING C12 I_PXCLK 5 4 3 2 1 GND33A_HSRT_O HC3 HC4 HC2 HC1 7 6 USB_SHADING C31 1u C10 10pF C11 10pF MINI USB 5P 10M SEN_SDA VDDAY S SEN_SCL C8 0.1u C7 4.7u + VDD5MV SEN_CSB VDDA VDD33A_HSRT_I C4 0.1u C30 0.1u C1 1u VDD33A_HSRT_I C2 1u VDDQ
D3
D4
D2
C5
A5
E3
VDDQ
PXCLK
HSYNC
VDDAY
VSYNC
VDDD
R1 100k VDD33A_HSRT_O C5 1u VDD33A_PLL_I VDD33A_HSRT_O
SEN_CLKE2 RESET E1 D1 I_PXD7 I_PXD6 A4 B4 A1
SY SCLK RESET VSSD PX9 PX8 PX0 PX7 PX6
CSB VDDA
PAS6311LT
VSSA SDA SCL PX1
PX5
PX4
PX3 C1 I_PXD1
VDDQ
VDD33Q I_PXD5 I_PXD4 I_PXD3 I_PXD2 I_PXD0
C2
A3
B3
B2
B1
PX2
GND2 NC + +5V
VDDA
VDDAY S
R3 1M Y 1 12MHz
Note: xx_N_M=> No Mount
R4 12k D+ DVDD33A_HSRT_O VDD33A_HSRT_I VDD33A_PLL_I OSC_OUT OSC_IN VDD5MV 37 VDD18K
20pF_N.M. C14 D+ DC13 C15 C16 22u 22u 0.1u VDD28A_MIC C17 C18 10u VCOM R5 0.01u + C19 C20 1u VDD33A_PGA R6 R8 2.2k 10k C21 1u VDD33A_ADC X1 + C22 C23 2.2u 2.2u C32 MICROPHONE R9 VDD33A_ADC 2.2k VSSQ WP R10 100k 100k VDD33Q VDD33Q C24 R12 1uF 300k RSTN SEN_CSB 10 11 12 9 C33 0.47uF_N.M. 0.47uF_N.M. VDD33A_PGA VSSA 7 8 10k VCOM MIC_P MIC_N 4 5 6 R7 VDD28A_MIC 3 5.1k 22u 1 VCOM VDD5MA 2 GND33A_PLL_I VDD5MA VDD28A_MIC VCOM MIC_P MIC_N VDD33A_PGA VSSA VDD33A_ADC VSSQ RSTN SEN_CSB + VDD28A_MIC SEN_CLK + +
20pF_N.M. VSSV
USB_5V
48
47
46
45
44
43
42
41
40
39 VDD33A_HSRT_O
XSCO
VDD33A_PLL_I
GND33A_HSRT_I
VDD33A_HSRT_I
VDD18K
RREF
VSSQ
DP
DM
XSCI
38
U2
VSSQ
VDDAY S VDD5MD I_PXCLK I_PXD0 I_PXD1 PAP7501_48P I_PXD2 I_PXD3 I_PXD4 I_PXD5 I_PXD6 I_PXD7 EPR_SCK
36 35 34 33 32 31 30 29 28 27 26 25
VDDAY S VDD5MD I_PXCLK I_PXD0 I_PXD1 I_PXD2 I_PXD3 I_PXD4 I_PXD5 I_PXD6 I_PXD7 EPR_SCK
EPR_HOLD R11
EPR_CSB
SEN_SDA
SEN_CLK
SEN_SCL
I_HSYNC
I_VSYNC
EPR_SO 23 EPR_SO
VDD33Q
VDD18K
VDD33Q
R13
GPIO_4
C25 20pF_N.M. R17 1K 1
25F512A
13
14
15
16
17
18
19
20
21
22
SEN_SDA
VDD33Q
GPIO_4
VDD18K
LED-0603 USB_5V VDD5MV VDD5MD VDD5MA VDD5MV C28 L1 1 L2 1 L4 1 1uF_N.M. VDD5MD C34 3.3u 2 3.3u 2 1uF_N.M. 2
SEN_CSB U4 KEY
C6 1u
R14 R15 10k 10k L3 VDD33Q VDD33Q 3.3uH VSSA
3.3u 2 1uF_N.M.
C26 C27
10u 0.1u
VDD5MA
C35
+
GPIO_4 VDD33Q R16 100k
C29
1u
EPR_SI
D1_Green KEY
I_HSYNC
EPR_CSB
SEN_CLK
SEN_SCL
I_VSYNC
24
EPR_SI
KEY
EPR_CSB 100k EPR_SO WP GND
1 2 3 4
CS VCC SO HOLD WP SCK GND SI
8 7 6 5
VDD33Q EPR_HOLD EPR_SCK EPR_SI
VDD33Q
U3
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PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw
V1.1 May. 2008
PixArt Imaging Inc. PAP7501V USB2.0 Camera
6. Update History
Version V1.0 V1.1 Update Creation, Preliminary 1st version Update circuit and Package information, Add C30~C35, R17, D1, Change R5 to 5.1k ohm, R6 and R9 Change to 2.2k ohm Date 01/17/2008 05/06/2008
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PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw
V1.1 May. 2008

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